Professional sample proofing
SMT-DIP plug-in processing
Professional BGA ball return
To undertake one-stop processing of OEM purchasing
產品用途:手機防盜器主板
層數:2
板材:FR-4
板厚:1.2mm
阻焊:綠油
最小線寬:0.12mm
最小孔徑:0.4mm
銅厚:孔銅20um、表銅1oz
表面處理:無鉛噴錫